In 6th IEEE CPMT International Symposium on High Density Packagin

In 6th IEEE CPMT International Symposium on High Density Packaging and Component Failure Analysis: June 30–July 3 2004; Shanghai, China. Edited by: IEEE. Piscataway: IEEE; 2004:259–263. 2. Kristiansen H: Electrical and mechanical properties of metal-coated polymer spheres for anisotropic conductive adhesive. In IEEE International Symposium on Polymeric Electronics Packaging: October 24–28 1999, Gothenburg, Sweden. Edited by: IEEE. Piscataway: IEEE; 1999:63–71. 3. Wang Evofosfamide manufacturer XT, Wang YL, Chen GL, Liu J, Lai ZH: Quantitative estimate of the characteristics of conductive Staurosporine manufacturer particles in ACA by using nano indenter.

IEEE T Compon Pack A 1998,21(2):248–251. 4. Lai ZH, Liu J: Anisotropically conductive adhesive flip-chip bonding on rigid and flexible printed circuit substrates. IEEE T Compon Pack B 1996,19(3):644–660. 5. He JY, Zhang ZL, Kristiansen H: Nanomechanical characterization of single micron-sized polymer particles. J Appl Polym Sci 2009,113(3):1398–1405.CrossRef 6. He JY, Zhang ZL, Midttun M, Fonnum G, Modahl GI, Kristiansen H, Redford K: Size effect on mechanical properties of micron-sized PS-DVB polymer particles. BIBW2992 ic50 Polymer 2008,49(18):3993–3999.CrossRef 7. Zhang ZL, Kristiansen H, Liu J: A method for determining elastic properties of micron-sized polymer particles by using flat punch test. Comput Mater Sci 2007,39(2):305–314.CrossRef 8. Fleck NA, Hutchinson JW: A phenomenological theory for strain

gradient effects in plasticity. J Mech Physics Solids 1993,41(12):1825–1857.CrossRef 9. Fleck NA, Muller GM, Ashby MF, Hutchinson JW: Strain gradient plasticity: theory and experiment. Acta Metall Mater 1994,42(2):475–487.CrossRef 10. Nix WD, Gao HJ: Indentation size effects in crystalline materials: a law for strain gradient plasticity. J Mech Phys

Solids 1998,46(3):411–425.CrossRef 11. Gerberich WW, Tymiak NI, Grunlan JC, Horstemeyer MF, Baskes MI: Interpretations of indentation size effects. J Appl Mech-T ASME 2002,69(4):433–442.CrossRef 12. Qi WH, Wang MP: Size effect on the cohesive energy of nanoparticle. J Mater Sci Lett 2002,21(22):1743–1745.CrossRef 13. Lian Phosphatidylinositol diacylglycerol-lyase J, Wang JL, Kim YY, Greer J: Sample boundary effect in nanoindentation of nano and microscale surface structures. J Mech Phys Solids 2009,57(5):812–827.CrossRef 14. Benzerga AA: Micro-pillar plasticity: 2.5D mesoscopic simulations. J Mech Phys Solids 2009,57(9):1459–1469.CrossRef 15. Nielsen SO, Lopez CF, Srinivas G, Klein ML: A coarse grain model for n-alkanes parameterized from surface tension data. J Chem Phys 2003,119(14):7043–7049.CrossRef 16. Zhao JH, Nagao S, Zhang ZL: Thermomechanical properties dependence on chain length in bulk polyethylene: coarse-grained molecular dynamics simulations. J Mater Res 2010,25(3):537–544.CrossRef 17. Faulon JL: Stochastic generator of chemical structure. 4. Building polymeric systems with specified properties.

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